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While electrorefining in a CuSO4 electrolyte (Cu anode to SS blank) what are the roles of additives (thiourea, glue, salt) in relation to bubble formation? More specifically, is there any evidence to support the claim that the potential to create more stable bubbles is increased with higher reagent dosing?
In a case where resilient bubbles adhere to cathodes, leave holes in deposits, and pump cavitation is unlikely, are the adhered cathodic bubbles more likely to be:
1. Air in electrolyte?
2. O2 from secondary anode reaction?
3. H2 from secondary cathode reaction?